BULLETIN of the

POLISH ACADEMY of SCIENCES

TECHNICAL SCIENCES

BULLETIN of the POLISH ACADEMY of SCIENCES: TECHNICAL SCIENCES
Volume 53, Issue 4, December 2005

Micro and Nano -scale mechanics

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pp 433 - 440

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Micro and nano structurization of semiconductor surface

A. Gorecka-Drzazga
The techniques of micro and nano structurization of surfaces of various materials are utilized in electronics and medicine. Such procedure as wet and dry etching allows to fabricate protruded or recessed micro and nanostructures on the surface. In the paper some examples of utilization of a surface structurization, known from literature, are described. Some structurization methods and experimental results for fabrication of the arrays of sharp microtips are presented. Wet and/or dry etching, and thermal oxidation process were used to form the arrays of sharp gated and non-gated, protruded or recessed silicon microtips on silicon wafer. For the first time, the arrays of silicon carbide (SiC) microtips on glass wafer have been produced by use of the transfer mold technique. Arrays of sharp microtips are used as field electron emission cathodes for vacuum microelectronics devices. Some electron emission measurements for these cathodes have been carried out. New application of silicon microtips array in biochemistry has been tested with satisfactory results.
 
Keywords:

silicon tips, SiC tips, transfer mold technique, field emission, FEA

 
 
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12 January 2006, site prepared  by KZ